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By: on November 1, 2021
November 01, 2021: The global Thermal Interface Materials Market is estimated to develop at a substantial CAGR for the duration of the prediction. Increase in the production of Electronic Constituents and surge in demand for smartphones in emerging nations are expected to motivate the market. Thermal Interface Materials are generally placed between two exteriors or constituents to intensify the thermal link and movement of heat amidst the two exteriors or constituents.These materials are utilize...
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By: on June 22, 2021
Rise in Need for Effective Thermal Management in Global Electronics Industry to Create Opportunity for Global Liquid Thermal Interface Materials Market · Effective thermal management remains a key to ensuring consistent long-term performance and reliability of electronic devices. Liquid versions of thermal interface materials have become increasingly prevalent in the recent years. These liquid products offer low-cost alternatives for thermal interface pads. · Liquid therm...
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By: on June 21, 2021
According to the latest report by IMARC Group, titled “Thermal Interface Materials Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026,” the global thermal interface materials market size reached US$ 2.80 Billion in 2020. Thermal interface materials (TIMs) are a category of products utilized to establish an effective thermal path between a heat-generating component and an attached heat-sink. They include a base material with added fillers to increase the therm...
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By: on May 19, 2020
May 19, 2020: The global thermal interface materials market size is expected to reach USD 3.33 billion by 2025, as per a new report by Radiant Insights, Inc., registering a CAGR of 10.8% over the forecast period. Rising demand of thermal interface materials (TIMs) in the automotive electronics on account of increasing vehicle production primarily in China, Indonesia, and Japan is likely to boost industry demand. Polyethylene is a material extensively used for the production of thermal inter...
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